Advanced SMP/E and SYSMOD Packaging

Audience

This course consolidates the delegates knowledge of installing and maintaining, using SMP/E, Program Products provided by IBM and other third party vendors by delving under the covers of SMP/E and provides a detailed practical insight into constructing and packaging your own SYSMODS.

Prerequisites

The delegate should be reasonably familiar with SMP/E to the level taught in the standard SMP/E course.

Duration

3 days. Hands on.

Course Objectives

This course provides students with a comprehensive grounding in the philosophy, capabilities, structure, commands and interactions within the SMP/E environment. The class will focus on constructing and packaging your own SYSMODS starting with constructing USERMODS for vendor supplied FUNCTIONS and concluding with how to package as FUNCTION type SYSMODS products in non-SMP/E format. Wherever possible the instructor will relate the class to the client’s SMP/E environment. In particular the labs can be based around the clients own USERMODS and non-SMP/E packaged products.

Course Content

Introduction to z/OS Product Processes
Assessing Packaging requirements and considerations
Contents of the Product Package
SYSMOD types and relationships
Fundamental Packaging considerations
Naming conventions
Elements and Load modules
Using MCS to manipulate Elements and Load Modules
Using MCS to define USERMODS
Using MCS to define FUNCTIONS
Using JCLIN
Packaging for special situations
National Language Support